Wan-Ting Chen

• Responsible for the quality and reliability management of Macbook pro, Macbook air, iMac, iphone16 and other products at the site of major suppliers of Foxconn and Quanta.
• Took initiatives to build a reliability laboratory, selected equipment, developed experimental plans and procedures, tracked the construction process, and organized on-the-job training and certification assessment for experimental staff.
• Managed the daily operation of supplier reliability lab, developed reliability test plan and execution plan, optimized test conditions and SOP, and continuously promoted test automation and data visualization in a timely manner.
• Led the product quality and reliability testing during NPI and sustaining, executed mechanical stress, shock and vibration drop, environmental testing, etc. according to the test plan, conducted fault risk assessment and coordinated multiple departments to formulate corrective and preventive measures, aiming to ensure 100% closed-loop issues, and continuously monitored product performance in the market after mass production.
• Conducted investigation and analysis of Foxconn automation test scheme, summarized experience, wrote analysis report and output smart lab video, promoted it to other 3 Apple suppliers.
• Maintained frequent communication with the US headquarters and cross-functional team to efficiently solve the problems arising during the testing process and ensure the project release as scheduled.

Value Creation:

• Built 6 reliability laboratories for mobile phones and laptops in total.
• Drove the cost reduction project and achieved the annual operating cost reduction of $507k and labor cost reduction of 1.15% by cancelling the packaging test of notebook and desktop.
• In order to reduce costs, Quanta supply chain planned to relocate to Vietnam, and built production failure rate analysis local capabilities, took the lead of the overall laboratory budget, hardware, space and equipment test method design, tracked the laboratory construction, and conducted operator training and qualification examination in a timely and proper manner.

• Assigned to Shenzhen and worked for on-site quality service of Huawei, Hisilicon, Xiaomi, TCL, Desay, Hisense, OPPO, VIVO and other key accounts in Greater China.
• Provided on-call and on-site technical support to customers, solve ad-hoc issues encountered in the process of technology R&D and customer complaints.
• Conducted technical analysis of problem chips, and greatly enhanced customer confidence in products by interpreting FA reports, 8D reports and technical design manuals.
• Maintained good communication with customers by regular visits, conference calls and face-to-face meetings, host QRR/QBR meetings and conveyed customer needs to headquarters in a timely manner.
• Accounted for the customer audit, identified the key points of customer audit such as QMS, process and registration, and well prepared for the new products’ introduction. Successfully introduced 3 new products accordingly.
• Continued to drive the cost optimization and achieved a reduction of 7.48 million yen in annual fault analysis costs by the negotiation and signing of MPA/RMA contracts with customers, reducing the repetitive fault analysis of known failure models.
• Managed the team members in Shenzhen and Shanghai, showed strong leadership in team goal clarification, ad-hoc issues handling, cross-function collaboration, etc., and always drive the team to deliver beyond-expectation results.

• Acknowledged with quality & reliability and semiconductor device technologies, and conducted quality and reliability analysis of NAND flash memory to ensure early detection of potential issues with next-generation 3D NAND products.
• Worked with cross-functional team to develop test plan according to product performance and cost, conducted NAND wipe, read, write and other tests under different operating environment.
• Used C++, Perl and Python to develop drive memory tools, and used data analysis tools such as Excel Macro, JMP and Minitab to draw life expectancy distribution, Gamma distribution, electron distribution and Weibull analysis, and analyzed root causes of failures in terms of process, material and technology.
• Advised the development team on design material or process changes.
  Led the audit of the in-house fabs and outsourcing suppliers including PTI and Amkor to ensure that the factories are qualified for new product manufacturing.
• Calculated the acceleration coefficient and collected the fault situation of the product to optimize the acceleration model, resulted in the single project test cost be reduced by 1.4 million yen and the test efficiency be increased by 30%+.