Poyo Chuang

Quality relative,

• Leading customer communication of quality relative projects.
• Leading Process Change Notification (PCN) negotiation and qualification follow up
• Ship to control
• On-site and on-line audit preparation & audit process
• Supplier quality Cp/Cpk review and CIP projects
• Day by day quality events handling, like OCAP investigation and report communication
• Wafer particle issue from PVD Cu alloy metal target - leading internal discussion & customer communication
• Ta coil threads dimensional issue, Cu target O-ring groove burr issue

Technical support,

• Customer PVD target qualifications
• AMAT Encore I, II - pure Cu & alloy targets
• Ta AK & IAK coil
• Ulvac PVD target - Cu & Cu alloy, pure W for memory customers
• backend packaging customers, TSV & UBM - Ti/TiW/Cu/NiV metal targets.
• 200mm Field Enhanced AlCu qualification
• Local tolling project - for localization purpose
• Trainer for fundamental target training, PVD concept, PVD target & thermal couple introduction, semiconductor wafer integration process flow - for Honeywell electronic materials crews & customers
• 2012 Performance Materials & Technologies Asia Commercial Excellence Award.
• 2023 Bronze bravo - urgent support for HSE improvement
• 2024 Silver bravo - leading tsmc fab18b Cu alloy metal target particle issue

• United Plan & Control team chairman, leading UPC department, 11 engineers for process & 18 engineers for equipment / machines
• Successful solved wafer chipping/broken issue with TF/wet clean/ET modules
• A to A+ yield up task force
• Leading integration team for 70nm DRAM wafer yield up from baseline ~85% to 90%.

• TF PVD process manager (2005/Feb
• ~ 2006/Aug.) Lead 90/70nm DRAM PVD area technology transfer from Hynix M10 fab Korea
• (2005 Mar.) Successful solved Ti/TiN CVD particle issue (TEL Trais tool)
• (Reduced particle count from 20K level down to
• W CVD thin down project
• (Cost saving 40%) ProMOS Fab3 year 2006 cost saving award - bronze medal
• SIP Ti particle reduction - Paper published in ELSEVIER of 2008 Yield improvement of post AlCu deposition
• - Paper published in ELSEVIER of 2008

• TF senior process engineer (2003/Aug
• ~ 2004/Jun.) Optimized Cu plating (ECP) auto dosing system
• Improved tool uptime ~ 5%, reduce engineering loading ~ 3%
• TF principal engineer (2004/Jun
• ~ 2005/Feb.) CVD-BD project owner - 1st AMAT Producer tool for Black-Diamond process for 90nm
• 90nm project - TF sponsor.

• Fab7 TF-CVD process engineer (2000/Jul
• ~ 2002/Feb.) Anti-crack SiN process - Patent passed TSMC review
• 2001 annual outstanding engineer award - bronze medal
• SOG coater optimization - TPT improved & cost saving
• PAPA (Passivation particle) reduction project
• Fab6 TF Cu-CVD process engineer (2002/Feb
• ~ 2003/Aug.) Build up Cu-CVD process team
• (Fab6 TF process engineering group split to Cu & AlCu team from 2002 June.) Making Cu-CVD process engineer working guideline
• Trainee of 8 assistance engineers
• (1st batch of assistance engineers of TSMC fab6).