Summary
Overview
Work History
Education
Skills
Accomplishments
Affiliations
Timeline
Generic

Deo Brat Singh

Summary

Proactive Director produces high-quality and robust semiconductor HV (Bulk/SOI) and RF (Si-Ge based BiCMOS) technologies by applying determination and attention to detail. Performance-oriented and enterprising leader with organized nature and analytical problem-solving approach.

Vast experience in semiconductor industry for Process transfer/Development/Integration experience of various processes (HV SOI and bulk BCD technology, Analog, logic, Trench MOS and Si-Ge based BiCMOS technology for RF applications

Overview

22
22
years of professional experience

Work History

Director, Technology Development

Silicon Manufacturing Company Pte Ltd, SSMC
10.2019 - Current
  • 31 People reporting
  • Responsible for managing technology development and technology roadmap for High voltage and Si-Ge based BiCMOS RF technologies
  • Responsible for managing tape out engineering and operation
  • Responsible for managing device characterization and wafer test operation

Deputy Director, Technology Development

Silicon Manufacturing Company Pte Ltd, SSMC
02.2017 - 10.2019
  • 0.14um HV bulk technology development
  • 0.14um SOI based HV technology development
  • 0.25um Si-Ge based BiCMOS technology transfer for RF applications
  • 0.14um Si-Ge based BiCMOS RF technologies development for high performance RF applications

Manager, Process Integration

Global Foundries 200mm BEU
04.2013 - 02.2017
  • 0.18um 10-30V ULL and Isolated BCD Lite Process (Low Rdson) Internal transfer and Ramp
  • 0.18um 16-30V Isolated BCD Lite Process Internal Transfer and Ramp
  • 0.18/0.16um 40V BCD Process Development/ External Transfer
  • 0.18um ULL analog and DDD process maintenance, improvement, new device integration
  • 0.18um Si Photonics Process Co-development

Sr. Section Manager, Process Integration

Global Foundries 200 BEU
04.2011 - 03.2013
  • 0.35um Embedded EEPROM (Standard bit cell) process maintenance and improvement
  • 0.35um Embedded EEPROM (Shrink bit cell) process integration optimization and ramp
  • 0.30um 30V BCD Process Development/ External Transfer
  • 0.7um Trench process development/External transfer and ramp

Section Manager, Process Integration

Global Foundries 200mm BEU
01.2010 - 03.2011
  • 0.35um Embedded EEPROM (Standard bit cell) process maintenance and improvement
  • 0.35um Embedded EEPROM (Shrink bit cell) process integration optimization and ramp
  • 0.5um EEPROM and Mask ROM process maintenance and improvement

Principle Engineer, Process Integration

Global Foundries 200mm BEU
10.2007 - 12.2009
  • Integrated the 32V LDNMOS process in 0.35um analog process technology
  • Integrated the 20V LDPMOS and 6V Zener Diode in the 0.35um 20V LDNMOS process

Sr Engineer, Process Integration

Global Foundries, 200 mm BEU
02.2005 - 09.2007
  • High voltage LDNMOS (20V) process integration and production ramp
  • High voltage DDD CMOS (18V) process maintenance and improvement

R & D Engineer

Semiconductor Complex Limited
Chandigarh, India
02.2000 - 01.2005
  • 0.8um HV CMOS process development
  • Development of 1.2um 30V CMOS process
  • Integration of high beta substrate collector NPN and collector isolated PNP in the 3.0 um (15V) CMOS process using the existing layer in the process

Education

M. Tech - Solid State Technology

Indian Institute of Technology (I.I.T)
India
12.1999

Master of Science - Solid State Physics

Banaras Hindu University (BHU)
India
07.1996

Skills

  • Attention to Detail
  • Task Delegation
  • Time Management
  • Problem Solving
  • Schedule Management
  • Administrative Functions

Accomplishments

  • 4 trade secretes and 3 publications in Semiconductor areas

Affiliations

Vast experience in semiconductor industry for Process transfer/Development/Integration experience of various processes (HV SOI and bulk BCD technology, Analog, logic, Trench MOS and Si-Ge based BiCMOS technology for RF applications. Hands on experience of device characterization, developing the quality and robust technologies and ramping of the processes with BIC yield.

People Manager since 2010. Capable of updating the knowledge. Capable of working with multi-cultural/multi-national team members.

Timeline

Director, Technology Development

Silicon Manufacturing Company Pte Ltd, SSMC
10.2019 - Current

Deputy Director, Technology Development

Silicon Manufacturing Company Pte Ltd, SSMC
02.2017 - 10.2019

Manager, Process Integration

Global Foundries 200mm BEU
04.2013 - 02.2017

Sr. Section Manager, Process Integration

Global Foundries 200 BEU
04.2011 - 03.2013

Section Manager, Process Integration

Global Foundries 200mm BEU
01.2010 - 03.2011

Principle Engineer, Process Integration

Global Foundries 200mm BEU
10.2007 - 12.2009

Sr Engineer, Process Integration

Global Foundries, 200 mm BEU
02.2005 - 09.2007

R & D Engineer

Semiconductor Complex Limited
02.2000 - 01.2005

M. Tech - Solid State Technology

Indian Institute of Technology (I.I.T)

Master of Science - Solid State Physics

Banaras Hindu University (BHU)
Deo Brat Singh